마이크로패키징-3D포장에 대하여(영문)

마이크로패키징-3D포장에 대하여(영문)

마이크로패키징-3D포장에 대하여(영문).pptx

목차 1.Introduction - Hot issue in 3D packaging 2.How to improve heat issue - Heat sink material - Paste as interfacial material - Heat sink design 3.The best idea - Material + Design + add 본문 Keff, Km, Kp: the effective thermal conductivities of the composite, Metal matrix, Particles φp : the volume fraction of reinforcements a : the diameter of the reinforcement - hc : the boundary conductivity. Advantage The air travels across the short length of the fins laterally, rather than longitudinally down the long length. Focused on placing the jets at the end of the fins and using them to induce air flow longitudinally down the length of the fin The primary jet to emanate directly through the heat sink base and entrain and expel air laterally over the height of the fins through a matrix of synthetic jets 본문내용 D packaging 2.How to improve heat issue - Heat sink material - Paste as interfacial material - Heat sink design 3.The best idea - Material + Design + add 5 Thesises of Group 4 1. 2. 3. 4. 5. Introduction High performance Light weight Small size Heat Density↑ Thermal problem↑ Problem of Advanced technology Thermal Problem 3D stacked chip & Thermal Cooling Techniques Refrigeration TEC with